Auto Care Association Communities Offer Leadership 2.0 Scholarship To Industry Professionals

The scholarship to attend the Leadership 2.0 Program is valued at more than $6,000 and includes the price of tuition, class materials and meals.


The Import Vehicle Community and the Young Auto Care Network Group (YANG), communities of the Auto Care Association, are offering full scholarships presented by the University of the Aftermarket Foundation for one of the association’s members to attend the highly acclaimed University of the Aftermarket’s 2018-’19 Leadership 2.0 Program. The scholarship is valued at more than $6,000 and includes the price of tuition, class materials and meals.

Leadership 2.0 is the premier post-graduate style leadership and business skills education program designed to promote the development of the next generation of auto care leaders. The intensive program is an intellectually challenging, two-week course that features top aftermarket executive speakers and the opportunity for discussion and debate about current aftermarket challenges and competitive strategies.

The program is appropriate for mid-level professionals working in any auto care industry market segment. Graduates of the Leadership 2.0 program receive 7.0 CEUs toward their AAP and MAAP designations.

Session I will be held Aug. 12-17 at the Northwood University campus in Midland, Michigan. Session II will be held March 10-15, 2019 in Raleigh, North Carolina.

An application and full criteria of all materials needed for consideration can be found at the links below.

YANG
Scholarship Information and Application
Deadline to apply: May 1
Questions? Contact Courtney Hammer at [email protected].

Import Vehicle Community
Scholarship Information and Application
Deadline to apply: April 24
Questions? Contact Angela Chiang at [email protected].

Applicants must be YANG or Import Vehicle Community members and current Auto Care Association members in good standing.

Click here to see some of the blogs from the previous Leadership 2.0 class.

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